Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.

• Box Build:  custom built to order system solutions
  • High complexity box assemblies and subsystems
  • High frequency RF box assemblies and subsystems
  • Full functional RF testing up to 26 GHz (K band)
• Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies
• Custom cell design for customer subsystems
• Special bonding processes including thermal management and vibration
• Robust torque and FOD control programs
• System level testing including functional, vibration and thermal
• Complex harness fabrication and integration
• Fiber-Optic and RF waveguide integration and testing
• Large system capacity in excess of 200 lbs.
• Configure to order – Integrate different options, firmware, configurations, etc across a single order as required